Auto Pure Tin and Tin Bismuth Plating Print E-mail
Products & Services - Semiconductor

Plating_

Purpose:

To tin plate the lead for better conductivity and avoid oxidation.

Equipment Type:

AEM, TECHNIC, PAL and STS

Chemistry:

100% Pure Tin, 100% Pure tin with Nickel under layer and Tin Bismuth process.

Compatibility:

plating__ Strip_Plating
Rack Plating
Strip to Strip Plating

  • Pure tin plate for 2 lds to 28lds, 32lds, 40lds and 42lds Cerdip and Plastic molded packages.
  • Fully automated. Loader from tube and reloaded into tube after plating process.
  • Automatic Strip to Strip plating.
  • Automatic Rack plating.
  • Plating Thickness from 200u”  to 800 u”
  • CPK at 1.67
  • Lead Frame width from 15mm to 60mm

Lead Frame Material (Base Metal):

Finished product plating on Copper, AL42  and Silver Plated Lead Frame

Plating Location:

Penang and Kuala Lumpur.

 
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